Manufacturing Facilities

Shenzhen Facility


Year of Mass Production: 1988
Product Range: 8 ~ 28 layer PCBs
Technology: Heavy copper (up to 12oz), high frequency materials, HDI
Monthly Capacity: 300K sq. ft


Shaoguan Facility



Year of Mass Production: 2005
Product Range: Double Side to 8 layer PCBs
Technology: Heavy copper (up to 6oz), high frequency materials
Monthly Capacity: 1.5 M sq. ft


Tongliao plant


Year of Mass Production: 2009
Product Range: Single sided, aluminum based, silver through hole PCBs (Phase I)
Monthly Capacity: 300K sq. ft (Phase I)

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