Periodic
Reverse Pulse Plating
"Reverse pulse plating" process provides high throwing
power plating for high aspect ratio (over 12 to 1) products and
uniforms plating distribution for uneven circuitry products.This
process is also commonly used for BGA and microvia products.
Taking
the advantages of the recent technological breakthrough on reverse
pulse plating rectifier and its chemistries, Topsearch deploys a
reverse pulse plating line, equipped with DRPP rectifier for mass
production. This pulse plating line is also able to provide non-air
agitation feature for fine-line plating production.
Picture of Reverse
Pulse Plating Line |