Periodic Reverse Pulse Plating

"Reverse pulse plating" process provides high throwing power plating for high aspect ratio (over 12 to 1) products and uniforms plating distribution for uneven circuitry products.This process is also commonly used for BGA and microvia products.

Taking the advantages of the recent technological breakthrough on reverse pulse plating rectifier and its chemistries, Topsearch deploys a reverse pulse plating line, equipped with DRPP rectifier for mass production. This pulse plating line is also able to provide non-air agitation feature for fine-line plating production.

Picture of Reverse Pulse Plating Line

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