Capability

Topsearch Printed Circuits Capabilities


Item
Production
Prototype
Max Layer Count 18 30
Max Board Thickness 0.175" 0.200"
Min Board Thickness 0.010" 0.008"
Max Working Panel Size 21" x 24" 24" x 26"
Drill to Metal 0.007" 0.006"
Min drill diamater 0.008" 0.006"
Innerlayer Registration +/- 0.003" +/- 0.002"
Line Width/Spacing, Outer/Inner (17 micron) 0.003" / 0.003"
 0.0025" / 0.0025"
Aspect Ratio </=12:1 </= 14:1
Min QFP Pitch (not HASL) 0.016" 0.010"
Controlled Impedance(Single ended)
                                 (Differential)		 50 - 90 ohms +/- 8%*
100 - 155 ohms +/- 10%*		 50 - 90 ohms +/- 8%*
100 - 155 ohms +/- 8%*
Max Internal Copper Wt. 6 oz 12 oz
HDI(2+N+2 Max Layer Count) -Min Via Size
                               - Min Capture Pad Size		 0.004"
0.012"		 0.004"
0.012"

* Less than 10% impedance tolerance capability is design dependent.


High Performance materials
Production
Prototype
Bismalemide Triazine
(BT) or equivalent
Yes
Yes
Nelco N - 4000 - 13 (SI)
Yes
Yes
Nelco N - 4000 - 13
Yes
Yes
Getek / Megtron
Yes
Yes
Rogers 4350
Yes
Yes
Rogers 3003/3006
Yes
Yes
Taconic RF35
Yes
Yes
Hitachi MCL-BE-67G
Yes
Yes
Polyclad PCL-FR370HR
Yes
Yes
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