Production Capability: 6oz
Pilot Capability: 12oz
Area of Application: Power module in power conversion and automotive segments

A. Inner Layer Capability
Maximum inner layer copper thickness: 12oz (400um)
Line width/line spacing: 20 mil/20 mil (Trace top)
Etch factor: 2.5


B. Outer Layer Capability
Maximum outer layer copper thickness: 6oz (200um)
Line width/line spacing: 16 mil/16 mil
Etch factor: 1.8


C. Blind Via
HDI penetrable inner copper thickness: 3oz


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